Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1993-01-05
1995-10-03
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257713, 257704, 257706, 257710, 257717, 257722, 361688, 361690, 361697, 361704, 361709, 361711, 361713, 361714, H01L 2302, H01L 2312, H05K 500
Patent
active
054554578
ABSTRACT:
A package for one or a plurality of semiconductor elements comprises a package substrate, at least one semiconductor element mounted on the package substrate having an active layer in a surface which faces away from the package substrate, a thin pliable electrically insulating resin layer applied to the surface of each semiconductor element, a metal cap which cooperates with the package substrate to hermetically enclose the space containing one or more semiconductor elements, and a heat diffusing plate of high thermal conductivity provided between the electrically insulating resin layer of each semiconductor element and the metal cap. A part of heat generated in the active layer is conducted through the heat diffusing plate to the metal cap and is released there, thereby shortening the heat path and reducing the heat-releasing surface of the package substrate.
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Crane Sara W.
Jr. Carl Whitehead
NEC Corporation
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