Dual resolution combined laser spot scanning and area imaging in

Optics: measuring and testing – Inspection of flaws or impurities – Surface condition

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356371, G01N 2188

Patent

active

061220469

ABSTRACT:
An optical inspection system for inspecting a substrate includes a light detector, a light source, a deflection system, an objective lens and an optical system. The light source produces an illuminating beam directed along a path to the substrate. The deflection system scans the illuminating beam on a scan line of the substrate. The objective lens focuses the illuminating beam on the substrate and coliects light reflected therefrom. The collected beam is angularly wider than the illuminating beam. The optical system directs the collected light beam along a path at least partially different than the path of the illuminating beam and focuses the collected beam on the light detector. In one embodiment, the system additionally includes at least one dark field detector for collecting light deflected from the substrate.

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G. Dickerson and R. Wallace, "In-line Wafer Inspection Using 100 Megapixel Per Second Digital Image Processing Technology,"SPIE vol. 1464 Integrated Circuit Metrology, Inspection, and Process Control, (1992), pp. 584-595.
David Alumot et al., "Dual Sensor Technology for High-Speed Detection of 0.1 Micron Defects, "Proceedings of the SPIE, vol. 1926, Integrated Circuit Metrology, Inspection, and Process Control VII, (1993), pp. 1-12.

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