Method of providing sacrificial spacer for micro-mechanical devi

Details Method of providing sacrificial spacer for micro-mechanical devi Method of providing sacrificial spacer for micro-mechanical devi

1994-06-21

1995-10-03

Powell, William

Etching a substrate: processes

Gas phase etching of substrate

Application of energy to the gaseous etchant or to the...

1566551, B44C 122, B29C 3700

Patent

active

054549060

ABSTRACT:
A method of fabricating micro-mechanical devices that use support elements (13) raised from a substrate (15), to support moveable elements (11). First, support elements (13) having reflective top surfaces (31) are fabricated. A layer of photoresist material (41) is then deposited over the support elements (13), to a thickness that substantially covers their reflective top surfaces (31). The photoresist layer (41) is exposed, which results in the areas (61) over the support elements (13) being more highly exposed than the areas (62) between the support elements (13). This permits a subsequent developing step that can be controlled to the purpose of removing the photoresist between the support elements (13) to a height planar with the reflective top surfaces of the support elements, while guaranteeing that the photoresist will be removed over the support elements (13).

REFERENCES:
patent: 5312513 (1994-05-01), Florence et al.
patent: 5314572 (1994-05-01), Core et al.

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