Multilayer circuit board

Details Multilayer circuit board Multilayer circuit board

1986-10-15

1987-11-10

Kucia, R. R.

Electricity: electrical systems and devices

Miscellaneous

174 685, 361404, 361412, 361414, H05K 118

Patent

active

047061650

ABSTRACT:
In a multilayer circuit board wherein a plurality of electronic parts are provided on a first principal plane, a plurality of brazing pads for pins are respectively arranged on a second principal plane and a plurality of wiring layers having wiring nets for connecting said electrical parts are formed between these principal planes. The EC pads for I/O leads for connecting discrete wires is provided to said first principal plane. EC pads are provided on said second principal plane and are connected to the brazing pads for pins in such a manner as to be electrically separable as required. The EC pads for I/O leads and the brazing pads for pins are connected through the interior of the multilayer circuit board and the EC pads are connected to the wiring net through the interior of the multilayer circuit board.

REFERENCES:
patent: 3605063 (1971-09-01), Stewart
patent: 3898370 (1975-08-01), Davy et al.
patent: 4016463 (1977-04-01), Beall et al.
patent: 4150421 (1979-04-01), Nishihara et al.
patent: 4254445 (1981-03-01), Ho
patent: 4434321 (1984-02-01), Betts
patent: 4464704 (1984-08-01), Huie et al.
patent: 4546413 (1985-10-01), Feinberg et al.
Drumm et al., EC Pad for Multi-Chip-Module Substrate Nets, IBM Tech. Disc. Bull., V. 21, #12, May 1979, p. 4801.

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