Resist compositions for plating

Details Resist compositions for plating Resist compositions for plating

1997-03-10

2000-01-04

Nuzzolillo, Maria

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

4302811, 4302861, G03C 173

Patent

active

060108231

ABSTRACT:
A resist composition for plating comprises a partial-acrylated, uncured novolac type epoxy resin as a photosensitive resin ingredient and an imidazole curing agent as a curing agent, wherein the imidazole curing agent is liquid at 25.degree. C. or the composition contains an acrylic ester polymer having a molecular weight of 500-5000. By using such a resist composition can be provided a printed wiring board having excellent conduction reliability and heat cycle property.

REFERENCES:
patent: 4902726 (1990-02-01), Hayashi et al.
patent: 4948700 (1990-08-01), Maeda et al.
patent: 5055378 (1991-10-01), Miyamura et al.
patent: 5412002 (1995-05-01), Enomoto et al.
patent: 5677398 (1997-10-01), Motoshima et al.
Database WPI, Section Ch, Week 8735, Derwent Publications Ltd., London, Jul. 22, 1987.
Chemical Abstracts, vol. 120, No. 26, Jun. 27, 1994.

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