Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent
1997-02-11
2000-05-09
Karlsen, Ernest
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
324757, 324765, G01R 1073, G01R 3128
Patent
active
060608919
ABSTRACT:
A probe card for testing semiconductor wafers, and a method and system for testing wafers using the probe card are provided. The probe card is configured for use with a conventional testing apparatus, such as a wafer probe handler, in electrical communication with test circuitry. The probe card includes an interconnect substrate having contact members for establishing electrical communication with contact locations on the wafer. The probe card also includes a membrane for physically and electrically connecting the interconnect substrate to the testing apparatus, and a compressible member for cushioning the pressure exerted on the interconnect substrate by the testing apparatus. The interconnect substrate can be formed of silicon with raised contact members having penetrating projections. Alternately the contact members can be formed as indentations for testing bumped wafers. The membrane can be similar to multi layered TAB tape including metal foil conductors attached to a flexible, electrically-insulating, elastomeric tape. The probe card can be configured to contact all of the dice on the wafer at the same time, so that test signals can be electronically applied to selected dice as required.
REFERENCES:
patent: 3866119 (1975-02-01), Adrezzone et al.
patent: 4795977 (1989-01-01), Frost et al.
patent: 4891585 (1990-01-01), Janko et al.
patent: 4906920 (1990-03-01), Huff et al.
patent: 4918383 (1990-04-01), Huff et al.
patent: 4952272 (1990-08-01), Okino et al.
patent: 5020219 (1991-06-01), Leedy
patent: 5034685 (1991-07-01), Leedy
patent: 5049813 (1991-09-01), Van Loan et al.
patent: 5124639 (1992-06-01), Carlin et al.
patent: 5172050 (1992-12-01), Swapp
patent: 5177439 (1993-01-01), Liu et al.
patent: 5180977 (1993-01-01), Huff
patent: 5264787 (1993-11-01), Woith et al.
patent: 5326428 (1994-07-01), Farnworth et al.
patent: 5408190 (1995-04-01), Wood et al.
patent: 5412329 (1995-05-01), Iino et al.
patent: 5419807 (1995-05-01), Akram et al.
patent: 5483741 (1996-01-01), Akram et al.
patent: 5495667 (1996-03-01), Farnworth et al.
patent: 5517126 (1996-05-01), Yamaguchi
patent: 5521522 (1996-05-01), Abe et al.
patent: 5578526 (1996-11-01), Akram et al.
patent: 5606263 (1997-02-01), Yoshizawa et al.
patent: 5686317 (1997-11-01), Akram et al.
patent: 5703494 (1997-12-01), Sano
patent: 5716218 (1998-02-01), Farnworth et al.
patent: 5825192 (1998-10-01), Hagihara
patent: 5869974 (1999-02-01), Akram et al.
patent: 5894161 (1999-04-01), Akram et al.
patent: 5952843 (1999-09-01), Vinh
"Cobra.TM. technology makes Wentworth Labs the world's most advanced probe card manufacturer.", Wentworth Laboratories advertising brochure, 1996.
"Science Over Art. Our new IC Membrane Test Probe", Packard Hughes Interconnect, advertising brochure, 1993.
Akram Salman
Doherty C. Patrick
Farnworth Warren M.
Hembree David R.
Krivy Andrew J.
Gratton Stephen A.
Karlsen Ernest
Micro)n Technology, Inc.
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