Semiconductor device

Details Semiconductor device Semiconductor device

1997-10-31

2000-05-09

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257691, 257698, 257729, H01L 2348, H01L 2552

Patent

active

060607742

ABSTRACT:
A copper sheet having an aperture provided therein at a bonding area for clearing the semiconductor chip and its bonding wires is bonded by an adhesive to a sealing side of an organic substrate which has been loaded on the sealing side with a pattern of copper foil wiring. The copper sheet is higher in adhesiveness to a sealing resin than to any conventional resist. A resultant semiconductor device according to the present invention will prevent detachment of the sealing resin at an interface, which may result from a thermal history in the sealing or reflow process and eliminate entrance of water, hence minimizing a decline in resistance to moisture.

REFERENCES:
patent: 4839713 (1989-06-01), Teraoka et al.
patent: 5689091 (1997-11-01), Hamzehdoost et al.
patent: 5767568 (1998-06-01), Tsuruzono

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