Process for etching copper base materials

Details Process for etching copper base materials Process for etching copper base materials

1990-02-23

1990-11-27

Kaplan, G. L.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156666, 204104, 204106, 204130, 204260, 204262, 252 792, 252 793, C23F 118

Patent

active

049733800

ABSTRACT:
A process for etching copper or a copper base material with an aqueous solution consisting essentially of peroxydisulfuric acid, up to about 500 ppm of a halide addition and the balance water is described. The process includes off-line generation/regeneration of the etching solution. An electrochemical cell for generating/regenerating the etching solution is also described.

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