Patent
1990-03-29
1991-09-03
Jackson, Jr., Jerome
357 80, H01L 2342, H01L 2344, H01L 2346, H01L 3902
Patent
active
050459236
ABSTRACT:
A contact structure has an IC carrier for holding an IC package which is placed on a socket and contact pieces of the IC package held by the IC carrier which is to be contacted with contacts of the socket. The contact structure in the socket with the IC carrier placed on the socket is characterized in that it further includes contact pieces for allowing the contacts to be contacted with IC contact pieces from above under pressure and the IC carrier is held between the socket and the IC package by pressure contact force which is to be exerted against the IC contact pieces by the contact pieces of the contacts.
REFERENCES:
patent: 4345267 (1982-08-01), Corman et al.
patent: 4381131 (1983-04-01), Demmianiuk
patent: 4435724 (1984-03-01), Ralstin
patent: 4547794 (1985-10-01), Tang
patent: 4745456 (1988-05-01), Clemens
patent: 4887149 (1989-12-01), Romano'
Jackson, Jr. Jerome
Jr. Carl Whitehead
Yamaichi Electric Mfg. Co. Ltd.
LandOfFree
Contact structure in socket with IC carrier placed thereon does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Contact structure in socket with IC carrier placed thereon, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Contact structure in socket with IC carrier placed thereon will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1013070