Contact structure in socket with IC carrier placed thereon

Patent

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Details

357 80, H01L 2342, H01L 2344, H01L 2346, H01L 3902

Patent

active

050459236

ABSTRACT:
A contact structure has an IC carrier for holding an IC package which is placed on a socket and contact pieces of the IC package held by the IC carrier which is to be contacted with contacts of the socket. The contact structure in the socket with the IC carrier placed on the socket is characterized in that it further includes contact pieces for allowing the contacts to be contacted with IC contact pieces from above under pressure and the IC carrier is held between the socket and the IC package by pressure contact force which is to be exerted against the IC contact pieces by the contact pieces of the contacts.

REFERENCES:
patent: 4345267 (1982-08-01), Corman et al.
patent: 4381131 (1983-04-01), Demmianiuk
patent: 4435724 (1984-03-01), Ralstin
patent: 4547794 (1985-10-01), Tang
patent: 4745456 (1988-05-01), Clemens
patent: 4887149 (1989-12-01), Romano'

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