Photopolymerizable composition with adhesion improving additive

Details Photopolymerizable composition with adhesion improving additive Photopolymerizable composition with adhesion improving additive

1983-12-20

1986-02-25

Brammer, Jack P.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430275, 430281, 522 72, 522 78, G03C 174

Patent

active

045728887

ABSTRACT:
A photopolymerizable composition which comprises as main ingredients (1) a non-gaseous ethylenic unsaturated compound which has at least two ethylenic unsaturated groups and forms a polymer by the aid of a photopolymerization initiator, (2) a thermoplastic organic polymer binder, (3) a photopolymerization initiator which is activated by activating light, and (4) a derivative of a thiohydrazide compound or at least one derivative of a carbothio acid amide. This composition forms a photoresist for producing printed circuit boards, printing plates, etc., by etching or plating. The photoresist has superior adhesion with respect to the base.

REFERENCES:
patent: 3429795 (1969-02-01), Delzenne et al.
patent: 4264710 (1981-04-01), Kondoh et al.
patent: 4346162 (1982-08-01), Abele

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