Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1984-12-13
1986-02-25
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29846, 29852, 29874, 156644, 156652, 156655, 156902, 156235, 156247, 156280, 1562722, 427 541, 427 96, 427 97, 427 98, 430312, 430313, 430315, B44C 122, B29C 1708, G03C 500, B05D 512
Patent
active
045727643
ABSTRACT:
Process for preparing multilayer printed circuits comprising laminating to a substrate bearing a circuit pattern or electrically conductive surface a photosensitive layer which is tacky or becomes tacky upon exposure; exposing the laminate to actinic radiation through a via image related to the underlying circuit pattern, if present; optionally removing the removable via image of the photosensitive layer in either the exposed or unexposed areas, e.g., with a solvent or peeling apart by removal of a cover sheet, if present; laminating to the remaining tacky photosensitive layer a layer of a second photosensitive composition; exposing the laminate to actinic radiation through a registered image pattern of at least one overlying segment of the via image area and conductive circuit pattern to form an image surface having nontacky areas and removable circuit image areas; removing the removable circuit image areas of the photosensitive layer in the exposed or unexposed areas with a solvent therefor, or peeling apart by means of a cover sheet, if present, the removable via image areas of the lower photosensitive, if present, are removed by a solvent therefor; embedding finely divided material, e.g., copper, into the tacky areas; optionally curing the laminate by means of actinic radiation and/or heat; plating electrolessly to form an interconnected electrically conductive circuit. Additional circuit layers can be added.
REFERENCES:
patent: 4157407 (1979-06-01), Peiffer
patent: 4469777 (1984-09-01), O'Neil
E. I. Du Pont de Nemours and Company
Powell William A.
LandOfFree
Preparation of photoformed plastic multistrate by via formation does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Preparation of photoformed plastic multistrate by via formation , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Preparation of photoformed plastic multistrate by via formation will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1012166