Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
Inventor
active
Chip package capable of reducing moisture penetration
Chip package capable of reducing moisture penetration
No associations
LandOfFree
Yung-Kang Chu does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with Yung-Kang Chu, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Yung-Kang Chu will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-P-2583423