4. Material or article handling
  5. Associated with semiconductor wafer handling
  6. Includes means for gripping wafer

Yun-liang Ouyang

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Method for forming a dielectric layer in a semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Method for transferring wafers in a semiconductor...

Material or article handling – Associated with semiconductor wafer handling – Includes means for gripping wafer
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2455338

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