4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Encapsulating

Yanshu Chen

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Encapsulation method for fine-pitch chip-on-board

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Patent

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Method of simultaneously attaching surface-mount and chip-on-boa

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
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Profile ID: LFUS-PAI-P-1078372

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