4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Including adhesive bonding step

Yanpei Deng

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Colloidal silica composite films for premetal dielectric...

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate

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Dielectric films for narrow gap-fill applications

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Dielectric films for narrow gap-fill applications

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2485524

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