4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Metallic housing or support

Ya-Ru Huang

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Integrated complex nano probe card and method of making same

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate

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Integrated complex nano probe card and method of making same

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate

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Method for manufacturing lead frames and lead frame material...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Method for reducing stress in nickel-based alloy plating

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating contains embedded solid material
Reexamination Certificate

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Optical fiber alignment element using integrated micro ball...

Optical waveguides – With optical coupler – With alignment device
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Profile ID: LFUS-PAI-P-2092557

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