4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Metallic housing or support

William H. Harmon

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Backside failure analysis capable integrated circuit packaging

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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RFID reader/writer device

Communications: electrical – Condition responsive indicating system – Specific condition
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2078863

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