4. Semiconductor device manufacturing: process
  5. Making device or circuit emissive of nonelectrical signal
  6. Packaging or treatment of packaged semiconductor

Willem H. Smits

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LED assembly for rear lamps in an automobile

Illumination – Supported by vehicle structure – Visual identification light
Reexamination Certificate

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Overmolded lens over LED die

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-3136059

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