Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2005-02-28
2008-03-18
Chaudhari, Chandra (Department: 2891)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C438S026000
Reexamination Certificate
active
07344902
ABSTRACT:
One or more LED dice are mounted on a support structure. The support structure may be a submount with the LED dice already electrically connected to leads on the submount. A mold has indentations in it corresponding to the positions of the LED dice on the support structure. The indentations are filled with a liquid optically transparent material, such as silicone, which when cured forms a lens material. The shape of the indentations will be the shape of the lens. The mold and the LED dice/support structure are brought together so that each LED die resides within the liquid silicone in an associated indentation. The mold is then heated to cure (harden) the silicone. The mold and the support structure are then separated, leaving a complete silicone lens over each LED die. This over molding process may be repeated with different molds to create concentric shells of lenses. Each concentric lens may have a different property, such as containing a phosphor, providing a special radiation pattern, having a different hardness value, or curable by a different technique (e.g., UV vs. heat).
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“Side-Emitting Optic,” Carclo Precision Optics data sheet, downloaded from www.carclo-optics.com, 2 pages.
Basin Grigoriy
Harbers Gerard
Hendriks Robert F. M.
Konijn Frans H.
Martin Paul S.
Chaudhari Chandra
Ogonowsky Brian D.
Patent Law Group LLP
Philips Lumileds Lighting Company LLC
Reames Matthew L.
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