4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Wayne Kever

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Apparatus and methods for cache line compression

Electrical computers and digital processing systems: memory – Storage accessing and control – Hierarchical memories
Reexamination Certificate

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Apparatus for cache compression engine for data compression...

Electrical computers and digital processing systems: memory – Storage accessing and control – Hierarchical memories
Reexamination Certificate

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Multidispatch CPU integrated circuit having virtualized and...

Electrical computers and digital processing systems: processing – Instruction issuing – Simultaneous issuance of multiple instructions
Reexamination Certificate

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Selective solder bump application

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Selective solder bump application

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2639238

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