4. Electricity: conductors and insulators
  5. Boxes and housings
  6. Hermetic sealed envelope type

Wan Gyan Choi

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Chip-size package (CSP) using a multi-layer laminated lead frame

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Semiconductor device package structure having column leads and a

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
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Profile ID: LFUS-PAI-P-403373

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