Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
Inventor
active
Ball grid array integrated circuit package structure
Ball grid array substrate strip with warpage-preventive...
Method of achieving solder ball coplanarity on ball grid...
Semiconductor package with embedded heat-dissipating device
No associations
LandOfFree
Tzong Da Ho does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with Tzong Da Ho, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Tzong Da Ho will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-P-2470128