4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Flip chip

Tushar T. Shah

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Insitu radiation protection of integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Insitu radiation protection of integrated circuits

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method for forming a micro column grid array (CGA)

Metal fusion bonding – Process – Preplacing solid filler
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2579181

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