4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Bump leads

Takeshi Kasai

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active

Chip package and method for manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Chip package and method for manufacturing the same

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Chip package and method for manufacturing the same

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Cordless pointing device and information terminal device

Computer graphics processing and selective visual display system – Display peripheral interface input device – Cursor mark position control device
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2083610

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