4. Electricity: conductors and insulators
  5. Insulators
  6. Through wall or plate

Takaharu Miyamoto

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Coaxial line assembly of a package for a high frequency element

Electricity: conductors and insulators – Insulators – Through wall or plate
Patent

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Method for manufacturing a semiconductor package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate

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Process for making a metal wall of a package used for accommodat

Metal fusion bonding – Process – With shaping
Patent

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Semiconductor package and method for manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Profile ID: LFUS-PAI-P-640594

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