4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Encapsulated
  6. With specified filler material

Takae Ishikawa

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Method for fabricating semiconductor device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Patent

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Semiconductor device having a cured silicone coating with non un

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified filler material
Patent

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Profile ID: LFUS-PAI-P-627364

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