4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Multiple housings

Tae-Hyeog Kang

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Method for plating of printed circuit board strip

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Package on package substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2302908

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