4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Swami Mathad

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Use of argon sputtering to modify surface properties by thin fil

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Patent

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Use of argon sputtering to modify surface properties by thin fil

Stock material or miscellaneous articles – Coated or structually defined flake – particle – cell – strand,... – Particulate matter
Patent

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Profile ID: LFUS-PAI-P-197647

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