4. Semiconductor device manufacturing: process
  5. Gettering of substrate

Sung-gyu Kang

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3-Dimensional comb structure and actuator and inertia...

Measuring and testing – Vibration – Sensing apparatus
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Flat evaporator

Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material
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Method of forming hydrophobic coating layer on surface of...

Metal working – Method of mechanical manufacture – Fluid pattern dispersing device making – e.g. – ink jet
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Multilayered wafer with thick sacrificial layer using porous...

Semiconductor device manufacturing: process – Gettering of substrate
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Silicon direct bonding method

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
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Profile ID: LFUS-PAI-P-2090074

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