4. Metal deforming
  5. By extruding through orifice
  6. With metal-deforming other than by extrusion

Stuart Weinshanker

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Heat-dissipating aluminum silicon carbide composite...

Metal deforming – By extruding through orifice – With metal-deforming other than by extrusion
Reexamination Certificate

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LDMOS transistor heatsink package assembly and manufacturing...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With housing mount
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2040349

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