4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Flip chip

Steven Fischman

Attorney

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Electronic package and method of forming

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Ground-plane device with back oxide topography

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
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Method and system for efficient layer 3-layer 7 routing of...

Multiplex communications – Pathfinding or routing – Switching a message which includes an address header
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Method for forming a uniform distribution of nitrogen in...

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
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Profile ID: LFUS-PAI-P-2609736

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