4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Flip chip

Stacy L. Freeman

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Apparatus and methods of semiconductor packages having...

Semiconductor device manufacturing: process – With measuring or testing – Electrical characteristic sensed
Reexamination Certificate

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Interconnection component for facilitating testing of...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2598843

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