4. Cleaning and liquid contact with solids
  5. Apparatus
  6. For work having hollows or passages

St Assembly Test Services PTE Ltd.

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Ground plane for exposed package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Leadframe for die stacking applications and related die...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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PBGA singulated substrate for model melamine cleaning

Cleaning and liquid contact with solids – Apparatus – For work having hollows or passages
Reexamination Certificate

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