4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Wire contact, lead, or bond

Soren Norskov

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Coils integrated in IC-package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Coils integrated in IC-package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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ESD-protection of integrated circuit

Electricity: electrical systems and devices – Safety and protection of systems and devices – Load shunting by fault responsive means
Reexamination Certificate

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VCO with programmable output power

Oscillators – With particular source of power or bias voltage
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2555435

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