4. Metallurgical apparatus
  5. Linings
  6. With making or repairing means

Shirish Shah

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Balanced coefficient of thermal expansion for flip chip ball...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Method and apparatus for cleaning and removing flux from an...

Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...
Reexamination Certificate

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Method of balanced coefficient of thermal expansion for flip...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
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Pumpable casting composition and method of use

Metallurgical apparatus – Linings – With making or repairing means
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Profile ID: LFUS-PAI-P-1607903

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