Semiconductor device and method of producing the same and semico

Details Semiconductor device and method of producing the same and semico Semiconductor device and method of producing the same and semico

1997-10-06

2000-08-29

Picard, Leo P.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257668, 257678, 257690, 257787, H01L 2302, H01L 2315

Patent

active

061113069

ABSTRACT:
A semiconductor device includes a semiconductor element, a holding substrate holding the semiconductor element, a frame body provided on the holding substrate so as to surround the semiconductor element and having a hole which communicates to a space formed between the holding substrate and the frame body and the frame body and the holding substrate form a housing, a plurality of leads having inner lead portions connected to the semiconductor element and outer lead portions extending outside the frame body, and a resin filling the space and encapsulating the semiconductor element and the inner lead portions. All of the outer lead portions extend outside the housing from one side of the housing.

REFERENCES:
patent: 5347159 (1994-09-01), Khandros et al.
patent: 5355580 (1994-10-01), Tsukada
patent: 5382829 (1995-01-01), Inoue
patent: 5394303 (1995-02-01), Yamaji
patent: 5440452 (1995-08-01), Kitahara
patent: 5679978 (1997-10-01), Kawahara et al.
patent: 5907187 (1999-05-01), Koiwa et al.
"Multilayer Circuitry Using Welded Metalized Polyimide Film", Funari et al, IBM Technical Disclosure Bulletin, vol. 22, No. 9, Feb. 1980.

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