4. Metal working
  5. Method of mechanical manufacture
  6. Electrical device making

Seok Goh

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Apparatus for removing wafer ring tape

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With bending – folding – winding – or wrapping means
Reexamination Certificate

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Heat sink to semiconductor module assembly equipment and method

Metal working – Method of mechanical manufacture – Electrical device making
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Module appearance inspection apparatus

Measuring and testing – Surface and cutting edge testing
Reexamination Certificate

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Semiconductor package having step type die and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2488591

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