4. Electricity: electrical systems and devices
  5. Housing or mounting assemblies with diverse electrical...
  6. For electronic systems and devices

Roger Fulghum

Attorney

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Attorney

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Fixed-gap solder reflow method

Metal fusion bonding – Process – Specific mode of heating or applying pressure
Reexamination Certificate

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Integrated circuit connection using an electrically...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Utility Patent

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Profile ID: LFUS-PAI-P-2052523

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