4. Powder metallurgy processes
  5. Forming articles by uniting randomly associated metal particles
  6. Consolidation of powders

Roger A. Emigh

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Compliant fibrous thermal interface

Stock material or miscellaneous articles – Pile or nap type surface or component – Interlaminar
Reexamination Certificate

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Electronic device having fibrous interface

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Electronic device having fibrous interface

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Sputtering target with ultra-fine, oriented grains and method of

Powder metallurgy processes – Forming articles by uniting randomly associated metal particles – Consolidation of powders
Patent

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Profile ID: LFUS-PAI-P-1272292

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