4. Adhesive bonding and miscellaneous chemical manufacture
  5. Methods
  6. Surface bonding and/or assembly therefor

Robert John Wojnarowski

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Alignment of optical interfaces for data communication

Illumination – Light fiber – rod – or pipe – Light emitting diode
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Alignment of optical interfaces for data communication

Optical waveguides – With optical coupler – With alignment device
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Broad band energy harvesting system and related methods

Electrical generator or motor structure – Non-dynamoelectric – Piezoelectric elements and devices
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Circuit chip package and fabrication method

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
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Circuit chip package and fabrication method

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
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Profile ID: LFUS-PAI-P-51527

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