4. Semiconductor device manufacturing: process
  5. Coating of substrate containing semiconductor region or of...
  6. Insulative material deposited upon semiconductive substrate

Renee′ R Berry

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Integrated circuit package having die with staggered bond...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Method for patterning dual damascene interconnects using a...

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate

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Method of connecting a bumped compliant conductive trace and...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Method of fabricating an improved spacer

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
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Method of fabricating node contacts

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2107898

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