4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Ramoji Karumuri Rao

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Flip-chip integrated circuit routing to I/O devices

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Flip-chip integrated circuit routing to I/O devices

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2008983

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