4. Electronic digital logic circuitry
  5. Interface
  6. Current driving

Pradeep Trivedi

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150 degree bump placement layout for an integrated circuit...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
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180 degree bump placement layout for an integrated circuit...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Accuracy of timing analysis using region-based voltage drop...

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
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Adjustment and calibration system for post-fabrication...

Thermal measuring and testing – Temperature measurement – By electrical or magnetic heat sensor
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Adjustment and calibration system for post-fabrication...

Miscellaneous active electrical nonlinear devices – circuits – and – Signal converting – shaping – or generating – Synchronizing
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Profile ID: LFUS-PAI-P-2433824

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