4. Cleaning and liquid contact with solids
  5. Apparatus
  6. With alarm, signal, indicating, testing, inspecting,...

Peng Sun

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Bonding method for through-silicon-via based 3D wafer stacking

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Ion extraction apparatus for single side wafers

Cleaning and liquid contact with solids – Apparatus – With alarm – signal – indicating – testing – inspecting,...
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Ion extraction process for single side wafers

Chemistry: analytical and immunological testing – Including sample preparation – Digestion or removing interfering materials
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Multiband antenna and multiband antenna system

Communications: radio wave antennas – Antennas – Microstrip
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Virtual grid

Multiplex communications – Diagnostic testing – Determination of communication parameters
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Profile ID: LFUS-PAI-P-1149808

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