4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. Of specified material other than copper

Peng Su

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Mechanical integrity evaluation of low-k devices with bump...

Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate

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Package device having crack arrest feature and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...
Reexamination Certificate

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Solderable metal finish for integrated circuit package leads...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Of specified material other than copper
Reexamination Certificate

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Profile ID: LFUS-PAI-P-3028827

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