4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Flip chip

Para Kanagasabai Segaram

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Method of bonding a semiconductor die without an ESD circuit...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Data processing: database and file management or data structures – Database design – Data structure types
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2874273

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