4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Including adhesive bonding step

Ormiston & McKinney PLLC

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Adjustable wafer transfer machine

Material or article handling – Movable rack having superposed – charge-supporting elements,... – Rack moved vertically by elevating means
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Apparatus and method for improving uniformity in batch...

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
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Apparatus for applying viscous materials to a lead frame

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Apparatus for applying viscous materials to a lead frame

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Apparatus for importing and exporting partially encrypted...

Data processing: financial – business practice – management – or co – Business processing using cryptography
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Profile ID: LFUS-PAI-P-2019501

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