4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Metallic housing or support

Noge Electronic Industries Co., Ltd.

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Lead frame, method for manufacturing the same, and semiconductor

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent

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Lead frame, method for manufacturing the same, and semiconductor

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Of specified material other than copper
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Profile ID: LFUS-PAI-P-391604

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