4. Organic compounds -- part of the class 532-570 series
  5. Organic compounds
  6. Silicon containing

Nigel Hacker

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Colloidal silica composite films for premetal dielectric...

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
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Dielectric films for narrow gap-fill applications

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Dielectric films for narrow gap-fill applications

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating
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Novolac polymer planarization films with high temperature...

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
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Novolac polymer planarization films with high temperature...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...
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Profile ID: LFUS-PAI-P-2433616

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