4. Adhesive bonding and miscellaneous chemical manufacture
  5. Delaminating processes adapted for specified product
  6. Delaminating in preparation for post processing recycling step

Naomi Obinata

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Apparatus for mounting a chip package to a chassis of a computer

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – Support brackets
Patent

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Method and apparatus for mounting a very large scale integration

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Process for RIE etching silicon dioxide

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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Profile ID: LFUS-PAI-P-1180484

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